Packaging method for semiconductor laser/detector devices
US5156999A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 8, 1990 |
| Grant date | Oct 20, 1992 |
| Priority date | — |
| Expiry date | Jun 8, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for packaging a hybrid device which has a semiconductor laser diode and photodetectors. The laser diode is mounted on a silicon chip (a "silicon submount") containing a photodetector for monitoring the laser power. An array of silicon submounts are mounted on a heat-sink plate which consists of a heat-sink substrate covered with a metal layer. The metal layer is cut in multiple places down to the heat-sink substrate to form multiple conductive strips. The heat-sink plate with the silicon submounts is then covered with a heat-sink cover plate which has identations formed to provide cavities for the silicon submounts. In addition, cavities are provided to allow connections to the conducting metal strips. The combined assembly is then sliced into bars exposing an opening for the laser diode and openings for connections to the conductive strips. The bars are turned on their sides and laminated to a glass substrate to form a front window for the laser diode assembly. The bar is then cut into separate pieces, each having a single laser diode. A photodetector may be mounted on the front of the glass window before or after the bar is cut into pieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.