Method for determining solder quality
US5157463A · kind A · utility
5Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 1991 |
| Grant date | Oct 20, 1992 |
| Priority date | — |
| Expiry date | Feb 15, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/95669
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for detecting defects in solder coatings on leads for electronic components maps the surface of the lead, detects light from the coated lead, and distinguishes defects in the coating based on the amount of reflected light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.