Pin fin heat sink including flow enhancement
US5158136A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1991 |
| Grant date | Oct 27, 1992 |
| Priority date | — |
| Expiry date | Nov 12, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heat dissipation performance of a pin fin heat sink is improved by utilizing a flow guide arrangement. Flow guide members are positioned relative to the outer rows of the pin fins and longitudinal to fluid flow through the pin fin field of the heat sink. A gap between a lower edge of each flow guide member and a base surface of the heat sink forms apertures allowing potentially stagnant fluid in an interior region of the pin fin field of the heat sink to communicate with fluid flowing around the exterior of the heat sink. This causes a so-called "pump" action in which the potentially stagnant fluid is drawn along with the fluid flowing around the exterior of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.