Metallically encapsulated elevated interconnection feature
US5158466A · kind A · utility
9Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1991 |
| Grant date | Oct 27, 1992 |
| Priority date | — |
| Expiry date | Mar 4, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pressure type contact (10) for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers in which one wafer is plated with a raised conductive interconnection feature. The raised feature is formed by placing a small lump (44) of electrically conductive resin on a substrate (12) and then electrolytically forming on the substrate a trace (18) having an enlarged connector pad (20) that completely covers the cured projecting resin lump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.