Selective metallization process
US5158860A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1990 |
| Grant date | Oct 27, 1992 |
| Priority date | — |
| Expiry date | Nov 1, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1415
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.