Method for interconnection between an integrated circuit and a support circuit, and integrated circuit adapted to this method
US5158911A · kind A · utility
54Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 23, 1991 |
| Grant date | Oct 27, 1992 |
| Priority date | — |
| Expiry date | Jul 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for the interconnection of an integrated circuit to a support, replacing the connection wires. An integrated circuit chip is fixed to a support by the brazing of the ground plane metallizations. However, the input/output pads of the integrated circuit are connected to the metallized tracks of the support by means of metallized holes. The method can be applied to microwave circuits. FIG. 3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.