Electroless plating-resisting ink composition
US5158989A · kind A · utility
30Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1990 |
| Grant date | Oct 27, 1992 |
| Priority date | — |
| Expiry date | Oct 9, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photocurable ink composition for forming patterns resistive to electroless plating is disclosed which includes (a) an epoxy resin, (b) an aliphatic polyol polyglycidyl ether as a reactive, viscosity controlling agent, (c) a photopolymerization catalyst, and (d) hydrophobic silica particles as a thixotropic agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.