Thermoplastic resin composition
US5159004A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1989 |
| Grant date | Oct 27, 1992 |
| Priority date | — |
| Expiry date | Nov 17, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed herein is a thermoplastic resin composition which comprises: PA0 (a) polyphenylene ether or a composition containing polyphenylene ether, PA0 (b) (i) a modified propylene polymer grafted with a styrene-based monomer or a mixture of a styrene-based monomer and a monomer copolymerizable with the styrene-based monomer, or (ii) a composition containing said modified propylene polymer and a propylene polymer, PA0 (c) a rubbery substance, and at least one component selected from the following three components; PA0 (d) a styrene resin having a melt index of 8 or above (at 250.degree. C. under a load of 5 kg), PA0 (e) a low-molecular weight hydrocarbon resin, and PA0 (f) white oil and/or liquid paraffin. This thermoplastic resin composition exhibits not only good moldability but also well-balanced physical properties and heat resistance, and can be easily processed into molded articles having outstanding physical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.