Method of manufacturing electronic module assembly
US5159751A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1992 |
| Grant date | Nov 3, 1992 |
| Priority date | — |
| Expiry date | Feb 18, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module assembly (31) is provided by assembling components (17) to a planar polyimide flex circuit film (14) laminated to an aluminum rigidizer plate (11). The flex circuit film and rigidizer are then bent by a sheet metal bending process such that the rigidizer plate forms an exterior protective housing and the components are provided in an interior space (30). Connector pins (23) provide external electrical access to the components and circuit patterns (15, 16, 19) on the film (14). Structures (24, 25, 29) mate with the bent plate and substantially enclose the interior space. Module cost is reduced since the existing flex circuit rigidizer plate is used to form part of the module housing, and economical planar component assembly techniques are utilized while eliminating the step of mounting the flex circuit rigidizer plate to an external module housing. Two techniques for using a mandrel shaft (26, 35) to bend the plate (11) without stressing the film (14) are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.