Method for lapping two surfaces of a titanium disk
US5159787A · kind A · utility
11Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Nov 3, 1992 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for lapping two surfaces of a titanium disk comprises inserting loosely a titanium disk to be lapped into an opening in a disk-type carrier, the carrier rotating and revolving between an upper surface plate and a lower surface plate which are held in parallel with each other and which applies lapping pressure to the titanium disk, feeding abrasives between the surface plates and the titanium disk and satisfying the following relationship between thickness t (mm) of the titanium disk and thickness T (mm) of the carrier: EQU 0.025 exp (t+1.5).ltoreq.T.ltoreq.0.9 t
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.