Process for producing cathodes for cathodic sputtering based on aluminium-silicon alloys
US5160388A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1991 |
| Grant date | Nov 3, 1992 |
| Priority date | — |
| Expiry date | Jul 9, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/043
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to a process for the production of targets to be used in the vacuum deposition of aluminium alloy by cathodic sputtering. The process consists of a heat treatment of the aluminium alloy disks making it possible to obtain a fine grain. It is characterized by the dissolving of the silicon, followed by controlled cooling bringing about the fine precipitation of the silicon and an optional silicon spheroidization treatment. After cooling, the disks are deformed with the press and undergo a final recrystallization treatment. The process is applied to the production of targets or cathodes for the coating of semiconductor silicon wafers by cathodic sputtering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.