Adjustable film cutoff unit
US5162071A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1990 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Jun 4, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1734
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film laminating apparatus which is operative to bond a continuous thin film to the surface of a base plate, using heat and pressure applied by a pressure laminating roller, and to cut the film to a length corresponding to that of the base plate. The apparatus has an adjustable film cut-off unit having a fixed cutter and a rotary cutter, both of which extend across the width of the thin film, transverse to the direction of continuous film feed. The fixed cutter and the rotary cutter are independently supported by members which are movable and convey the respective cutters into and out of a film cutting position. The support members are movable manually, to permit initial insertion of the thin film into a cutoff position, and automatically during continuous operation of the thin film laminating apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.