Method of producing microstructered metallic bodies
US5162078A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 1991 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Jul 5, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/003
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method of producing microstructured metallic bodies in which plastic negative molds of the microstructures are produced on an electrically conductive base plate by means of electron beam lithography, X-ray lithography or a micromolding technique. Cavities of the negative molds are filled with metal by electroplating while employing the electrically conductive base plate as an electrode. In the course of producing the negative molds, a residual plastic layer is left at the bottom of the cavities of the negative molds on the electrically conductive base plate. Also, before the cavities of the negative molds are filled with metal by electroplating, the residual plastic layer at the bottom of the cavities is removed by means of reactive ion etching with ions that are accelerated perpendicularly toward the surface of the base plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.