Process and apparatus for control of electroplating bath composition
US5162079A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 28, 1991 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Jan 28, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process and apparatus for electroplating metals in which the metal salt concentration within the electroplating bath is reduced by providing an insoluble anode assembly in the bath. The insoluble anode assembly includes an enclosure which defines a compartment around an insoluble anode and which is formed at least in part by an anion exchange membrane. The primary reaction at the insoluble anode during electroplating is electrolysis of water to produce predominantly oxygen and hydrogen ions. The flow of current through the insoluble anode assembly causes anions in the plating solution to travel through the anion membrane into the compartment, resulting in an increase in acid concentration within the compartment. Accumulated acid is periodically flushed from the compartment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.