Patent · US Expired

Thermoplastic polypropylene-polyamide molding compositions of high toughness, rigidity and heat-distortion resistance, and the preparation thereof

US5162422A · kind A · utility

16Cited by
4References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 8, 1990
Grant dateNov 10, 1992
Priority date
Expiry dateJun 8, 2010

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L51/06
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Novel polypropylene-polyamide molding compositions which comprise, based on 100 parts by weight of the molding compositions, PA1 A) 10 to 89.9 parts by weight of one or more polypropylene homopolymer and/or copolymer, PA1 B) 10 to 89.9 parts by weight of one or more polyamide, PA1 C) 0.1 to 5.0 parts by weight of one or more olefinically unsaturated carboxylic acid and/or one or more olefinically unsaturated carboxylic acid derivate, PA1 D) 0 to 3.0 parts by weight of an impact modifier, and PA1 E) 0 to 60.0 parts by weight of a reinforcing agent and/or additive, are prepared by melting together components (A), (C) and, if desired (D) at from 200.degree. to 300.degree. C. in a first reaction step and then, in a second reaction step, introducing component (B) and, if appropriate, components (D) and/or (E) into the modified melt obtained, and melting together the components. The molding compositions obtained are used for the production of moldings.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.