Thermoplastic polypropylene-polyamide molding compositions of high toughness, rigidity and heat-distortion resistance, and the preparation thereof
US5162422A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1990 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Jun 8, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Novel polypropylene-polyamide molding compositions which comprise, based on 100 parts by weight of the molding compositions, PA1 A) 10 to 89.9 parts by weight of one or more polypropylene homopolymer and/or copolymer, PA1 B) 10 to 89.9 parts by weight of one or more polyamide, PA1 C) 0.1 to 5.0 parts by weight of one or more olefinically unsaturated carboxylic acid and/or one or more olefinically unsaturated carboxylic acid derivate, PA1 D) 0 to 3.0 parts by weight of an impact modifier, and PA1 E) 0 to 60.0 parts by weight of a reinforcing agent and/or additive, are prepared by melting together components (A), (C) and, if desired (D) at from 200.degree. to 300.degree. C. in a first reaction step and then, in a second reaction step, introducing component (B) and, if appropriate, components (D) and/or (E) into the modified melt obtained, and melting together the components. The molding compositions obtained are used for the production of moldings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.