Epoxy resin composition with hydrogenated diene glycidyl ether
US5162437A · kind A · utility
4Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1990 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Mar 12, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition, comprisng a glycidyl ether of a hydrogenated conjugated diene polymer, an epoxy resin, and a reaction product of a phenolic compound with formaldehyde, having improved flexibility and thermal stability and useful for sealing a semiconductor device, whereby thermal stress can be effectively reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.