Hot melt adhesives
US5162457A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1991 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Oct 31, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S528/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to crystalline, isocyanate group-containign hot melt adhesives based on PA1 from 70-95% by weight of a prepolymer A based on polyester diols having a molecular weight of from 1500 to 10,000 and melting points of from 50.degree. to 90.degree. C. and diisocyanates in a ratio of isocyanate groups of the diisocyanate to the hydroxyl groups of the polyester diol of from 3:1 to 1.2:1 and PA1 from 5-30% by weight of a component B having a molecular weight of from 1000 to 10,000 based on polyesters having melting points of from 60.degree. to 150.degree. C., in which component B contains at most 0.5 Zerewitinow active groups per molecule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.