Molded electrical apparatus
US5162726A · kind A · utility
4Cited by
14References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1990 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Sep 12, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F27/022
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A support arrangement is provided for an electrical device that is embedded within a support body or housing. The support arrangement responds to volumetric changes in the material of the support body during the molding of the support body. In a specific arrangement, the support arrangement accurately positions the electrical device with respect to the exterior of the support body and includes provisions for yieldingly supporting the electrical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.