Semiconductor integrated circuit having a dummy lead and shaped inner leads
US5162894A · kind A · utility
14Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1990 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Nov 14, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit includes a semiconductor chip having a plurality of pad electrodes fixed in a lead frame. Electrical leads connected to the chip include outer lead portions, external to the lead frame, and inner lead portions, internal to the lead frame and electrically connected to the semiconductor chip. At least one lead is a dummy lead, providing additional space in the lead frame. Due to the extra space, the inner lead portions may have various shapes, including large leads, or branched leads, for elimination power noise.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.