IC package for high-speed semiconductor integrated circuit device
US5162896A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 1991 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Feb 7, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/118
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tape-automated bonding substrate or TAB substrate used for mounting a gallium arsenide IC chip having external connection terminals including signal input and output terminals thereon is shown. Conductive thin-film wiring lines are formed on an insulative thin-film layer. These thin-film wiring lines include feed-through type signal input wiring lines to be connected to the input terminals of the chip. Each feed-through type signal input wiring line has an inner lead to which a corresponding signal input terminal of the chip is directly connected, a terminal pad for receiving a high-speed input signal, and a terminal pad to which an impedance-matching resistor is to be connected. The feed-through type signal input wiring lines have a composite line structure of micro-strip signal transmission and co-planar signal transmission line structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.