Method of cloning printed wiring boards
US5163005A · kind A · utility
6Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1990 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Dec 19, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/301792
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method of cloning printed wiring boards by milling one side of the board to a minimum thickness, then X-raying the board to produce a film negative. This negative is photographed to provide a reversed negative which is converted to a diazo photograph.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.