Method and apparatus for loading metal leadframes with electronic components
US5163222A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 1991 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | May 15, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53052
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for transferring relatively thin, strip-like workpieces, such as metal leadframe strips to at least one processing or bonding station are proposed. The apparatus essentially comprises a transfer mechanism, a processing or bonding station, an electromotive drive, a first and a second group of electromagnetically, pneumatically or hydraulically operable clamping elements. The first group of the clamping elements is movable relative to the second group of clamping elements fixed to a main carrier of the transfer mechanism. In a first phase of the transfer and feed movement, the electromotive drive is controlled by means of reference geometry data given in dependence upon a particular leadframe and in a second phase of the feed movement by means of dynamic, opto-electronically measured reference data and pulses formed therefrom. The supply movement of the leadframe to the processing or bonding station takes place in a transfer direction (X') at an angle (.alpha.) displaced in a side and plane relative to the main carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.