Reflow soldering apparatus
US5163599A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1990 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Oct 2, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A reflow soldering apparatus having a pre-heating chamber and a reflow chamber, wherein a hot gas recirculation system including a cross-flow blower, a diverging nozzle and a heater is provided in the reflow chamber or both in the pre-heating chamber and the reflow chamber, so that a hot gas such as heated air is uniformly applied to the object such as a combination of a substrate and an electronic parts carried by the substrate, whereby uniform distributions of temperature and flow velocity of the hot gas are attained. The hot gas recirculation means may be arranged so as to vary the angle at which the hot gas impinges upon the substrate and the breadth over which the hot gas is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.