Method of bonding members having different coefficients of thermal expansion
US5163770A · kind A · utility
10Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1990 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Apr 5, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/477
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A method of bonding at least two members having different coefficients of thermal expansion is disclosed, wherein an edge of a bonding interface between the members is positioned in a tapered portion, thereby bridging one member having a smaller coefficient of thermal expansion and another having a larger coefficient of thermal expansion. A bonded composite article comprising such bonded members having the different coefficients of thermal expansion is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.