Electrostatic discharge protection devices for semiconductor chip packages
US5163850A · kind A · utility
19Cited by
11References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 27, 1991 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Nov 27, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plurality of electrostatic discharge (hereafter referred to as "ESD") protection devices are disclosed for use with semiconductor chip packaging (hereafter referred to as "SCP"). The electrostatic protection devices comprise electrically conductive shorting devices that may be removably connected to the SCP during the manufacture to short selected pins from the SCP. The ESD protection devices remain in place to provide ESD protection during all phases of handling and shipping and may be either automatically unshorted or be manually removed during final assembly when the SCP is installed in its end product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.