Sputtering cathode arrangement according to the magnetron principle for coating a flat annular surface
US5164063A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1991 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Oct 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a sputtering cathode arrangement according to the magnetron principle for the coating of a flat circular substrate, with a circular ring-shaped target and an outer mask and inner mask disposed between the target and the substrate, a magnet system with a yoke plate being disposed in back of the target for the production of the magnetron effect, the inner mask is fastened to a mask holder which is brought through the center of the target, the magnet system with the yoke plate (8) being disposed for rotation about an axis of rotation (M) going through the center of the target, and consisting of at least two magnet arrangements (9,9', . . . ; 10,10', . . . ) off-center from the axis of rotation, each of which produces a self-contained tunnel of magnetic lines of force, each tunnel lying outside of the axis of rotation (M), and the eccentric dispositions of the two magnet arrangements with respect to the axis of rotation (M) being so chosen that the sum of the rate contributions of all target portions within magnetic lines of force from magnetrons and deposited on the substrate is very uniform across the radius within the circular coating surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.