Patent · US Expired

CVD method for depositing a layer on an electrically conductive thin layer structure

US5164222A · kind A · utility

15Cited by

9References

17Claims

0Family size

Assignee

Mas-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V. · DE

Inventors

Oliver Gottsleben · Göttingen, DE
Michael Stuke · Göttingen, DE

Key dates

Filing date	Jul 20, 1990
Grant date	Nov 17, 1992
Priority date	—
Expiry date	Jul 20, 2010

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C16/46
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for depositing a layer of additional material onto an electrically conductive thin layer structure preferably by means of the thermally induced reason of a compound in the vapor state, in which the thin structure is heated by an electric current passed through it. The method is especially suitable for reinforcing metallic conductor structures which have been made on a substrate by a direct-writing-laser chemical vapor deposition method, for example, fine tungsten wires.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.