Nonwoven preform sheets of fiber reinforced resin chips
US5164255A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1991 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Nov 12, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A nonwoven planar preform sheet for a polymer composite consisting of 20% to 80% by weight reinforcing fibers and 20% to 80% by weight matrix resin, the reinforcing fibers being from 1/8 to 6 inches in length from 1 to 50 micrometers in diameter, and being arrayed in the composite as chips of from 2 to 5000 parallel filaments, each substantially uniformly coated with matrix resin, all of the filaments of each chip ending in a single plane orthogonal to the filament direction, where the thickness of the chips is from 1 to 50 filament diameters and the length to thickness ratio is greater than 100. The chips may be either randomly oriented or oriented in the same direction in the plane of the sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.