Method of connecting TAB tape to semiconductor chip, and bump sheet and bumped tape used in the method
US5164336A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1990 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Sep 6, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of connecting a TAB tape to a semiconductor chip is disclosed which comprises the steps of preliminarily locating and fixing bumps at positions corresponding to a pattern of electrodes of the semiconductor chip to be connected; and bonding the bumps by thermocompression to the electrodes of the semiconductor chip and the leads of the TAB tape, respectively, so that each electrode of the semiconductor chip is electrically connected to the corresponding lead of the TAB tape through a corresponding one of the bumps. Also disclosed are a bump sheet and a bumped tape to be used in a method of connecting a TAB tape to a semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.