Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste
US5164816A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 1991 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Aug 2, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.