Patent · US Expired

Removable VLSI assembly

US5164818A · kind A · utility

16Cited by

3References

12Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Arnold Blum
Frank Gerth · Tübingen, DE
Manfred Perske · Sindelfingen, DE
Manfred Schmidt · Krefeld, DE

Key dates

Filing date	Sep 24, 1991
Grant date	Nov 17, 1992
Priority date	—
Expiry date	Sep 24, 2011

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/176
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A system for mounting VLSI devices on a substrate is disclosed, offering a high contact density. Each package consists of a semiconductor device having protruding elongated contact pin (2) on its surface and a wiring substrate having a cavity (3) on its surface. The cavities are filed with a conductive material (7) of a low melting point composition and sealed with a thin non-conductive foil (4). During packaging, the contact pins are made to penetrate the foil, and extend into the conductive alloy, thus making electrical contact therewith. To ease the penetration of the foil, the contact pins could be set into oscillating motion by means of an ultrasonic generator.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.