Die eject system for die bonder
US5165521A · kind A · utility
5Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1992 |
| Grant date | Nov 24, 1992 |
| Priority date | — |
| Expiry date | Jun 18, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die eject system for a hybrid die bonder, in particular an automatic hybrid die bonder, comprises a support, on which a plurality of die eject heads are mounted. The die eject heads can be sequentially indexed into an operative position. The system has the advantage that it is possible to change rapidly from one head to another, either to eject different sizes of dice or in the case of damage to a die eject needle within a die eject head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.