Process for manufacturing integrated device with improved connections between the pins and the semiconductor material chip
US5165590A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1992 |
| Grant date | Nov 24, 1992 |
| Priority date | — |
| Expiry date | Apr 13, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20755
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing devices with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.