Adapting frequency band of oscillating circuit made from a metal-plastic-metal sandwich foil and sandwich foil for implementing the process
US5165987A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1991 |
| Grant date | Nov 24, 1992 |
| Priority date | — |
| Expiry date | Dec 23, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Foil includes a first etch-resistant layer which at least partially covers the neighboring layer and has a weight per unit area of 0.5-20 g/m.sup.2, a first aluminum or aluminum alloy layer having a thickness of about 30 .mu.m to 150 .mu.m, a dielectric layer of plastic having a thickness of about 5 to 100 .mu.m, a second aluminum or aluminum alloy layer having a thickness of about 30 .mu.m to 150 .mu.m, and a second etch-resistant layer which at least partially covers the neighboring layer and has a weight per unit area of 0.5 to 20 g/m.sup.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.