Thin film surface mount fuses
US5166656A · kind A · utility
75Cited by
14References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 1992 |
| Grant date | Nov 24, 1992 |
| Priority date | — |
| Expiry date | Feb 28, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49789
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
SMD fuses having consistent operating characteristics are fabricated by forming a repeating lithographic fuse element pattern on an insulative substrate, passivating the structure, bonding a protective glass plate over the passivation layer, slicing the assembly so formed, terminating the slices and cutting the slices into individual fuses. Fuses thus manufactured may be of any desired dimensions, including standard and non-standard chip sizes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.