High density interconnect apparatus
US5167511A · kind A · utility
34Cited by
21References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1990 |
| Grant date | Dec 1, 1992 |
| Priority date | — |
| Expiry date | Nov 27, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/403
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.