Soldering flux
US5167729A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | May 15, 1991 |
| Grant date | Dec 1, 1992 |
| Priority date | — |
| Expiry date | May 15, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3613
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a soldering flux which prevents a release of an active ion contained in an activator when exposed to a high-temperature atmosphere maintaining at a temperature higher than 80.degree. C., for example, an atmosphere of an engine room of an automobile, and thus makes washing unnecessary. This soldering flux comprises, together with an activator, (1) a thermoplastic resin having a softening point not lower than 80.degree. C., and/or (2) an epoxy group-containing compound, a radical-polymerizable unsaturated double bond-containing compound or a blocked isocyanate group-containing compound, or (3) a thermosetting resin composed of a carboxyl group-containing resin and an epoxy resin and/or a thermosetting resin containing carboxy and epoxy groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.