Gold conductor composition for forming conductor patterns on ceramic based substrates
US5167869A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1991 |
| Grant date | Dec 1, 1992 |
| Priority date | — |
| Expiry date | Oct 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A gold conductor composition comprising by weight, basis total inorganic solids, finely divided particles of 75-95% metallic gold at least 90% by weight of which gold particle have an aspect ratio of no greater than 2, 0.5-10% cadmium borosilicate glass, 0.1-5% spinel-forming divalent metal oxide selected from the group consisting of CuO, ZnO, MgO, CoO, NiO, FeO, MnO and mixtures thereof, and 0.1-1.0% metal selected from the group consisting of palladium, platinum and rhodium, all of the foregoing particles being dispersed in an organic medium. This composition is useful in electronic packaging for forming conductor patterns on ceramic-based substrates, particularly patterns on which metallic components are bonded by brazing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.