Method for exposing predetermined area of peripheral part of wafer
US5168021A · kind A · utility
20Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1990 |
| Grant date | Dec 1, 1992 |
| Priority date | — |
| Expiry date | Aug 22, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2022
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for exposing a peripheral part of a wafer according to the present invention is to expose the peripheral part, taking account of a correcting angle determined by calculating the amount of misalignment between a center of a wafer and a rotational center for the wafer from the amount of displacement of a sensor for detecting a peripheral edge. Therefore, any wafer-centering motion and mechanism are not required, and this method is higher in precision of exposing position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.