Method for laser cutting metal plates
US5168143A · kind A · utility
22Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1990 |
| Grant date | Dec 1, 1992 |
| Priority date | — |
| Expiry date | Oct 31, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/364
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser cutting method for complex capillaries wherein a multi-mode beam from a solid-state is reduced to predominantly a single mode and focused to a spot about 40 microns in diameter. The laser is focused about 0.2 to 0.3 mm above the work piece. The predominantly single mode is a TEMoo mode. By recutting the capillary slots with the laser, metal oxide particles condensed from the vapor phase and resolidified molten metal on the walls of the slots are removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.