Copper vapor laser modular packaging assembly
US5168393A · kind A · utility
0Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 1989 |
| Grant date | Dec 1, 1992 |
| Priority date | — |
| Expiry date | Jan 18, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/031
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A modularized packaging arrangement for one or more copper vapor lasers and associated equipment is disclosed herein. This arrangement includes a single housing which contains the laser or lasers and all their associated equipment except power, water and neon, and means for bringing power, water, and neon which are necessary to the operation of the lasers into the container for use by the laser or lasers and their associated equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.