Formation of high quality patterns for substrates and apparatus therefor

US5168454A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Mark J. LaPlante · Montgomery, US
• Mark Gerald LaVine · Colchester, US
• David C. Long · Wappingers Falls, US
• Poyang Lu · Hopewell Junction, US
• John J. Seksinsky · Poughkeepsie, US
• Lawrence D. Thorp · Yorktown, US
• Gerhard Weiss · Ludwigshafen, DE

Key dates

• Filing date: Oct 30, 1989
• Grant date: Dec 1, 1992
• Expiry date: Oct 30, 2009

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/0017
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An apparatus and method for accurately and rapidly machining a workpiece, particularly for drilling holes smaller than can be formed by other methods, by using a high power pulsed Nd:YAG laser. A low power HeNe laser is joined to the optical path of the high power laser. The colinear beams then scan along one axis of the workpiece. The low power beam is partially split off to a location determining device before final deflection to the workpiece. Deflection in a second axis is achieved by linearly moving the workpiece so that the beam will impinge upon the desired location of the workpiece.