Method for soldering and apparatus therefor
US5169057A · kind A · utility
4Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Dec 8, 1992 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/341
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.