Apparatus for wafer processing with in situ rinse
US5169408A · kind A · utility
153Cited by
15References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1990 |
| Grant date | Dec 8, 1992 |
| Priority date | — |
| Expiry date | Jan 26, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing apparatus including a head defining an etching chamber, the sidewall of the head being slidable along the base so that the sidewall and base will normally define an etch chamber; and the sidewall may be moved upwardly to open a discharge passage for rinsing water, and a deflecting surface for deflecting the rinsing water downwardly and draining the rinsing water from the passage. The housing is separable above the deflector ring to provide access to the wafer for inserting the wafer and replacing it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.