Method for forming non-columnar deposits by chemical vapor deposition
US5169685A · kind A · utility
26Cited by
15References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1990 |
| Grant date | Dec 8, 1992 |
| Priority date | — |
| Expiry date | Nov 1, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/455
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Fine-grained and/or equiaxed coatings, substantially free from columnar structure, are deposited on substrates by chemical vapor deposition by directing the flow of reactant gases to the substrate with high velocity and in close proximity thereto, most often at a velocity gradient of at least about 1050 and preferably at least about 2000 cm./cm.-sec. The deposition process is preferably conducted while moving the substrate so as to coat large areas thereof. By this method, tungsten and/or rhenium X-ray targets having excellent properties under conditions of rapid temperature cycling may be produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.