Tin lead process
US5169692A · kind A · utility
6Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1991 |
| Grant date | Dec 8, 1992 |
| Priority date | — |
| Expiry date | Nov 19, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for replenishing a tin-lead alloy displacement plating solution which comprises periodically adding complexing agent to the solution during use of the same to bring the total concentration of complexing agent to an amount sufficient to ensure adhesion of the deposit to its underlying substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.