Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation
US5169805A · kind A · utility
43Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1991 |
| Grant date | Dec 8, 1992 |
| Priority date | — |
| Expiry date | May 29, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.