Electronic module assembly
US5170326A · kind A · utility
35Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1991 |
| Grant date | Dec 8, 1992 |
| Priority date | — |
| Expiry date | Dec 2, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module assembly (50) has a bendable base plate (52) upon which circuit components (76) are mounted. A module enclosure device (56) mates with the base plate and has an integrally formed, non-removable support arm (96). During assembly, the base plate (52) is bent around the support arm (96) in a "C" shape. Thus formed, the base plate (52) and the module enclosure device (56) form an internal cavity that holds the circuit components (76).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.