Filled thixotropic resin compositions comprising epoxy resin, curing agent, sugar-aldehyde and filler
US5171769A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1991 |
| Grant date | Dec 15, 1992 |
| Priority date | — |
| Expiry date | Apr 11, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G4/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A filled thixotropic resin composition (A) comprises a curable epoxide resin, a filler and, as thickening agent, a condensation product of a sugar alcohol with an aromatic aldehyde, the composition being thickened and made thixotropic such that the filler remains substantially uniformly dispersed therein on storage and such that upon addition of (B) a curing amount of a curing agent comprising a polyamine having at least one primary amine group attached directly to an aliphatic or cycloaliphatic carbon atom or a polycarboxylic acid anhydride, the curing agent substantially counteracts the thixotropic effect of the thickening agent to give a pourable curable composition which is no longer thixotropic and has a viscosity up to about 200 Pa s.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.