Molded circuit package having heat dissipating post
US5172213A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 23, 1991 |
| Grant date | Dec 15, 1992 |
| Priority date | — |
| Expiry date | May 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A major issue in the semiconductor industry is the amount of power that a silicon device dissipates. As the density of silicon integrated circuits increases with improvements in wafer processing, so does the amount of heat which must be evacuated. If the power of the silicon devices exceeds one watt, the plastic encapsulating material normally yields to the more expensive ceramic or metal packages which can dissipate thermal energy more efficiently. The conventional molded package is a silicon device such as a chip mounted onto a copper paddle which spreads the heat radially in the material and is bonded to leads via thin wires. The three major paths for the heat to escape are by conduction through the molding compound to the surface of the package where removal is by convection, and by conduction from the silicon device through the thin wires to the leads of the package and then to the printed circuit board, and by a heat conducting paddle which radially spreads the heat through the molding compound. In each instance, the heat dissipating path is through a relatively poor thermal conductor. In accordance with the principles of the invention, there is provided an improved thermal p…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.